LGA-MLP: LGA Molded Lid Package – Laminate substrate based package with an LCP molded lid.
Custom LCP Mold:
• Lid shape can be more complex than a metal stamped lid.
• Finished package has square sides. Package Options:
• Multi die
• Stacked die
• Wire bond / Flip chip
• SMT passives
• Top/Bottom Port
• Glob top
• Complex lid shape | 
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