1.png

The TSSOP has a tighter lead pitch is thinner (at 0.9 mm) than the standard SOP. These IC packages are particularly suited for gate drivers, controllers, wireless / RF, op amps, logic, analog, ASICs, memory (EPROM, E²PROM), comparators and optoelectronics.

Package Configurations (PDF).pdf


Get In Touch

Have questions? Our drone experts are here to help

Submit

, by Shenzhen Enliten Technologies Co., Ltd. (MA5HMCAN-6)   腾云建站仅向商家提供技术服务 网站地图 备案号:粤ICP备2023108342号-1